Method for forming crystal grain packaging protective layer

Method for forming crystal grain packaging protective layer

This invention refers to a method for forming crystal grain package protective layer, which contains providing chip with first or second surface having plurality of crystal grain, forming light transmitted package protective layer to completely cover the first or second surface of chip.

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Hauptverfasser: MEIHUI WU, BOREN WU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MEIHUI WU
BOREN WU
description This invention refers to a method for forming crystal grain package protective layer, which contains providing chip with first or second surface having plurality of crystal grain, forming light transmitted package protective layer to completely cover the first or second surface of chip.
format Patent
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for forming crystal grain packaging protective layer
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