Method for forming crystal grain packaging protective layer
This invention refers to a method for forming crystal grain package protective layer, which contains providing chip with first or second surface having plurality of crystal grain, forming light transmitted package protective layer to completely cover the first or second surface of chip.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | This invention refers to a method for forming crystal grain package protective layer, which contains providing chip with first or second surface having plurality of crystal grain, forming light transmitted package protective layer to completely cover the first or second surface of chip. |
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