Heat conducting and anti distortional wood floor

A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arra...

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description A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arranging and sticking horizontal accouplement along to wood floor width direction and heat conducting material is added in adhesive.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1600540A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1600540A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1600540A3</originalsourceid><addsrcrecordid>eNrjZDDwSE0sUUjOz0spTS7JzEtXSMxLAeKSTIWUzOKS_KKSzPy8xByF8vz8FIW0nPz8Ih4G1rTEnOJUXijNzSDv5hri7KGbWpAfn1pckJicmpdaEu_sZ2hmYGBqYuBoTFgFALudKnk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat conducting and anti distortional wood floor</title><source>esp@cenet</source><creator>YEKAI TANG</creator><creatorcontrib>YEKAI TANG</creatorcontrib><description>A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arranging and sticking horizontal accouplement along to wood floor width direction and heat conducting material is added in adhesive.</description><edition>7</edition><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050330&amp;DB=EPODOC&amp;CC=CN&amp;NR=1600540A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050330&amp;DB=EPODOC&amp;CC=CN&amp;NR=1600540A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YEKAI TANG</creatorcontrib><title>Heat conducting and anti distortional wood floor</title><description>A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arranging and sticking horizontal accouplement along to wood floor width direction and heat conducting material is added in adhesive.</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwSE0sUUjOz0spTS7JzEtXSMxLAeKSTIWUzOKS_KKSzPy8xByF8vz8FIW0nPz8Ih4G1rTEnOJUXijNzSDv5hri7KGbWpAfn1pckJicmpdaEu_sZ2hmYGBqYuBoTFgFALudKnk</recordid><startdate>20050330</startdate><enddate>20050330</enddate><creator>YEKAI TANG</creator><scope>EVB</scope></search><sort><creationdate>20050330</creationdate><title>Heat conducting and anti distortional wood floor</title><author>YEKAI TANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1600540A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YEKAI TANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YEKAI TANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat conducting and anti distortional wood floor</title><date>2005-03-30</date><risdate>2005</risdate><abstract>A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arranging and sticking horizontal accouplement along to wood floor width direction and heat conducting material is added in adhesive.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
title Heat conducting and anti distortional wood floor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T18%3A55%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YEKAI%20TANG&rft.date=2005-03-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN1600540A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true