Heat conducting and anti distortional wood floor
A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arra...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A heat conducting and antideforming wood floor is formed by cross-overlying and sticking longitudinal layer board on horizontal layer board as longitudinal board is prepared by arranging and sticking longitudinal accouplement along to wood floor length direction, horizontal board is prepared by arranging and sticking horizontal accouplement along to wood floor width direction and heat conducting material is added in adhesive. |
|---|