Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

The invention includes anodes for electroplating baths. The anodes have purity or at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise at least 99.995% copper/phosphorus alloy, by weight; or at least...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: T.L. WHITE, N.F. DEAN, W. WEISER
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention includes anodes for electroplating baths. The anodes have purity or at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise at least 99.995% copper/phosphorus alloy, by weight; or at least 99.995% nickel and sulfur, by weight. The invention also includes methods of electroplating materials over semiconductor substrates.