Fluidic mems device

A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate...

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Bibliographische Detailangaben
Hauptverfasser:	BOUCHER WILLIAM R, HALUZAK CHARLES C, SMITH MARK A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate 2, the substrate 3 and a breach 42 in the bond ring 4 may define a fill port 111.