High adhesion leadless soldering tin grease

The invention discloses a leadless solder paste with high adhesion force for electron product surface pasting. The leadless solder paste contains a Sn-Ag-Cu-Bi-Ni base leadless solder powder blended with solder agent. The solder agent is made up of 35-50wt% of resin (such as modified abietic resin a...

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Bibliographische Detailangaben
Hauptverfasser:	HESHENG DENG, YAOQIANG YU, HEJUN DENG
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses a leadless solder paste with high adhesion force for electron product surface pasting. The leadless solder paste contains a Sn-Ag-Cu-Bi-Ni base leadless solder powder blended with solder agent. The solder agent is made up of 35-50wt% of resin (such as modified abietic resin and waterless malic acid resin), 1-10wt% of thixotrope(such as modified hydro castor oil, fatty glyceride), 35-55%wt% of solvent (undercanol, dimethyl hexanediol), 1.5-5wt%of activator (succinic acid, tetrabutyl amine hydrobromic acid). The solder agent may also include 0.01-0.9wt% copper inhibitor made up of one or several of benzothiazole, benzotrinitrogenazole, and benzimidazole.