High radiation LED light emitting assembly and its mfg. method

Heat emission resin is prepared by mixing heat emission powder and capsulation resin. One time of capsulation is carried out for upper zone of luminosity of LED by using transparent capsulation resin. Multiple times of capsulation is carried out for lower heat elimination zone of LED by using heat e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SONGYUE XIE, JIMING ZHANG, DIANRUN FENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!