High radiation LED light emitting assembly and its mfg. method

Heat emission resin is prepared by mixing heat emission powder and capsulation resin. One time of capsulation is carried out for upper zone of luminosity of LED by using transparent capsulation resin. Multiple times of capsulation is carried out for lower heat elimination zone of LED by using heat e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SONGYUE XIE, JIMING ZHANG, DIANRUN FENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Heat emission resin is prepared by mixing heat emission powder and capsulation resin. One time of capsulation is carried out for upper zone of luminosity of LED by using transparent capsulation resin. Multiple times of capsulation is carried out for lower heat elimination zone of LED by using heat emission resin. Thus, when LED is illumined by large current, heat energy generated through lower heat elimination zone can be conducted to outside. The invention improves issue of heat collection, and raises luminous efficiency. The invention does not change procedure of fabricating rack type LED and manufacturing tools. Only one more step of filling resin is needed to carry out.