Microelectronic package having an integrated heat sink and build-up layers

一种微电子封装件制造方法，包括将至少一个微电子管芯连附到一散热器并将所述微电子管芯/多个管芯封装于其上，还可以包括使微电子封装芯靠接该散热器，其中微电子管芯/多个管芯处于所述微电子封装芯内的至少一个开口中。在封装后，可以制造多个增加层以形成与所述微电子管芯/多个管芯相连的电连接。 A microelectronic package fabrication technology that attaches at least one microelectronic die onto a heat spreader and encapsulates the microelectronic die/dice thereon which may further include a microelectronic packaging core abutting the heat spreader wherein the microelectronic die/dice reside within at least one opening in a microelectronic package core. After encapsulation, build-up layers may be fabricated to form electrical connections with the microelectronic die/dice.