Moisture-reactive hot-melt adhesive

本发明提供了可用作粘合剂的湿气反应性热熔型粘合剂组合物。该组合物尤其可用作粘结型材-包裹材料制品的粘合剂。本发明还提供了使用该组合物制备型材-包裹材料制品的方法和这样制备的型材-包裹材料制品。 A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KESSELMAYER MARK ALAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:本发明提供了可用作粘合剂的湿气反应性热熔型粘合剂组合物。该组合物尤其可用作粘结型材-包裹材料制品的粘合剂。本发明还提供了使用该组合物制备型材-包裹材料制品的方法和这样制备的型材-包裹材料制品。 A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method for making profile-wrap articles using the composition and the profile-wrap articles so made.