Fluxing compositions

本发明提供了一种螯合助熔剂、其在助熔组合物中应用、以及其在焊接方法中的应用。但混合一种树脂，如热固性树脂、热塑性树脂或其组合物时，所述助熔剂得到了适用作未充满粘合剂的组合物。本发明也提供了一种包含上述未充满粘合剂组合物的电气元件组件及其制造方法。 The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when comb...

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Bibliographische Detailangaben
Hauptverfasser:	CHARLES SCOTT B, KINNEY ROBERT J, KROPP MICHAEL A
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	本发明提供了一种螯合助熔剂、其在助熔组合物中应用、以及其在焊接方法中的应用。但混合一种树脂，如热固性树脂、热塑性树脂或其组合物时，所述助熔剂得到了适用作未充满粘合剂的组合物。本发明也提供了一种包含上述未充满粘合剂组合物的电气元件组件及其制造方法。 The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.