Solid-state imaging device and method for producing the same

本发明涉及一种固体摄像装置及其制造方法，该固体摄像装置包括：平板状基板(1)、固定在基板上的摄像元件(2)、在基板上设置成包围摄像元件的肋(3)、固定在肋上面的透光板(4)、用于从由基板、肋、以及透光板形成的封装的内部向外部电导出的多个布线(6)、设置在封装的空间内连接摄像元件的电极和各布线的金属细线(7)。布线包括：在摄像元件的安装面上形成的内部电极(6a)、在其背面的与内部电极对应的位置形成的外部电极(6b)、在基板的端面上形成，来连接内部电极和外部电极的端面电极(6c)。基板的端面、肋的侧面以及透明板的端面实质上形成同一平面。具有外部端子的基台结构简单，且可容易实现小型化。 A solid-state imaging device includes: a planar substrate 1; an imaging element 2 fixed onto the substrate; a rib 3 provided on the substrate so as to surround the imaging element; a transparent plate 4 fixed to a top face of the rib; a plurality of wirings 6 for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires 7 for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode 6a disposed on a surface with the imaging element mounted thereon; an external electrode 6b disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode 6c disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the nb and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.