Combination of heat conducting materials softend at low temperature, preparation method and application
A heat-conducting composite rubber able to be softened at 38-65 deg.C is prepared through proportionally mixing liquid-state acrylonitrile rubber with vinyl polyacetate, and adding heat-conducting agent chosen from alumina, zinc oxide, aluminium nitride, etc. It can be made into film or heat-conduct...
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| creator | ZHONGYI JIAN YULONG CHEN |
| description | A heat-conducting composite rubber able to be softened at 38-65 deg.C is prepared through proportionally mixing liquid-state acrylonitrile rubber with vinyl polyacetate, and adding heat-conducting agent chosen from alumina, zinc oxide, aluminium nitride, etc. It can be made into film or heat-conducting sheet, or for filling it in seam of electronic package or heat radiator.
本发明涉及一种低温软化导热胶材组合物及其制备方法和应用，用分子量300～100000的液态丙烯腈橡胶与聚醋酸乙烯混合，制成软化温度38～65℃的胶材，添加适量的导热剂，如氧化铝、氧化锌、氮化铝，氮化硼、石墨、金属粉或纳米粘土等制成次微米或纳米粉末导热剂，可制成薄膜厚度在0.01～5mm之间，热传导系数在0.5～5W/m-K之间，热阻抗值在0.005～0.2℃m#+[2]/W之间的导热片，且其软化温度范围在38～65℃，可避免存放及运送中液化，用于电子组件与散热器填缝热传导接口，以提高热传导效率。 |
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本发明涉及一种低温软化导热胶材组合物及其制备方法和应用，用分子量300～100000的液态丙烯腈橡胶与聚醋酸乙烯混合，制成软化温度38～65℃的胶材，添加适量的导热剂，如氧化铝、氧化锌、氮化铝，氮化硼、石墨、金属粉或纳米粘土等制成次微米或纳米粉末导热剂，可制成薄膜厚度在0.01～5mm之间，热传导系数在0.5～5W/m-K之间，热阻抗值在0.005～0.2℃m#+[2]/W之间的导热片，且其软化温度范围在38～65℃，可避免存放及运送中液化，用于电子组件与散热器填缝热传导接口，以提高热传导效率。</description><edition>7</edition><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041027&DB=EPODOC&CC=CN&NR=1539901A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041027&DB=EPODOC&CC=CN&NR=1539901A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHONGYI JIAN</creatorcontrib><creatorcontrib>YULONG CHEN</creatorcontrib><title>Combination of heat conducting materials softend at low temperature, preparation method and application</title><description>A heat-conducting composite rubber able to be softened at 38-65 deg.C is prepared through proportionally mixing liquid-state acrylonitrile rubber with vinyl polyacetate, and adding heat-conducting agent chosen from alumina, zinc oxide, aluminium nitride, etc. It can be made into film or heat-conducting sheet, or for filling it in seam of electronic package or heat radiator.
本发明涉及一种低温软化导热胶材组合物及其制备方法和应用，用分子量300～100000的液态丙烯腈橡胶与聚醋酸乙烯混合，制成软化温度38～65℃的胶材，添加适量的导热剂，如氧化铝、氧化锌、氮化铝，氮化硼、石墨、金属粉或纳米粘土等制成次微米或纳米粉末导热剂，可制成薄膜厚度在0.01～5mm之间，热传导系数在0.5～5W/m-K之间，热阻抗值在0.005～0.2℃m#+[2]/W之间的导热片，且其软化温度范围在38～65℃，可避免存放及运送中液化，用于电子组件与散热器填缝热传导接口，以提高热传导效率。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjLsKwkAQRdNYiPoNzgcoGIJFSgmKlZV9GDc3yUJ2Z9hM8PeNj97qwrmHs8y6SsLDRzYvkaSlHmzkJDaTMx87CmxInoeRRmkNsaH5H-RJhqBIbFPCjjRBOX0jAdbLrL1V1cG7D15ni3auYPPbVba9nO_VdQ-VGqOyQ4TV1S0_FmV5yE_Ff-MFCRs_vQ</recordid><startdate>20041027</startdate><enddate>20041027</enddate><creator>ZHONGYI JIAN</creator><creator>YULONG CHEN</creator><scope>EVB</scope></search><sort><creationdate>20041027</creationdate><title>Combination of heat conducting materials softend at low temperature, preparation method and application</title><author>ZHONGYI JIAN ; YULONG CHEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1539901A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2004</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHONGYI JIAN</creatorcontrib><creatorcontrib>YULONG CHEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHONGYI JIAN</au><au>YULONG CHEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Combination of heat conducting materials softend at low temperature, preparation method and application</title><date>2004-10-27</date><risdate>2004</risdate><abstract>A heat-conducting composite rubber able to be softened at 38-65 deg.C is prepared through proportionally mixing liquid-state acrylonitrile rubber with vinyl polyacetate, and adding heat-conducting agent chosen from alumina, zinc oxide, aluminium nitride, etc. It can be made into film or heat-conducting sheet, or for filling it in seam of electronic package or heat radiator.
本发明涉及一种低温软化导热胶材组合物及其制备方法和应用，用分子量300～100000的液态丙烯腈橡胶与聚醋酸乙烯混合，制成软化温度38～65℃的胶材，添加适量的导热剂，如氧化铝、氧化锌、氮化铝，氮化硼、石墨、金属粉或纳米粘土等制成次微米或纳米粉末导热剂，可制成薄膜厚度在0.01～5mm之间，热传导系数在0.5～5W/m-K之间，热阻抗值在0.005～0.2℃m#+[2]/W之间的导热片，且其软化温度范围在38～65℃，可避免存放及运送中液化，用于电子组件与散热器填缝热传导接口，以提高热传导效率。</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Combination of heat conducting materials softend at low temperature, preparation method and application |
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