Flame retardant molding compositions
公开了一种基本上不含卤素、磷和锑的阻燃模塑组合物。还公开了这些阻燃模塑组合物涂布电子器件如集成电路的应用。该阻燃模塑组合物包括环氧树脂、含高熔点金属的第一种过渡金属氧化物如三氧化钨;和含VIA族元素的含氧阴离子和IIA族元素的阳离子的第二种过渡金属氧化物如钼酸钙。 Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | 公开了一种基本上不含卤素、磷和锑的阻燃模塑组合物。还公开了这些阻燃模塑组合物涂布电子器件如集成电路的应用。该阻燃模塑组合物包括环氧树脂、含高熔点金属的第一种过渡金属氧化物如三氧化钨;和含VIA族元素的含氧阴离子和IIA族元素的阳离子的第二种过渡金属氧化物如钼酸钙。
Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate. |
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