Metallized dielectric substrates for EAS tags

薄金属喷镀无机/聚合物电介质基片(24)在两侧面上涂覆有金属，用于制造谐振电路标签(20)。该电介质层包括穿过的通路孔(31)，并直接形成于第一导电箔层上。第二导电金属层沉积在该电介质层上和通路孔中，以便使这两个导电层互连。该结构随后利用抗蚀剂而蚀刻形成电路中的电感器(28)和电容器板(27、29)。该电路的失效可靠性将通过由非机械方法形成均匀和一致的电介质层临界击穿厚度而增强。且不需要专用标签表面区域来用于机械互连并能够使电容器板更小，从而使可用于电感器线圈的表面面积最大，从而增加给定尺寸标签的电感和检测范围，或者对于相同的检测范围制造更小的标签。 A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal layer. The organic layer may be formed by flexographic printing. In both cases, a via hole is formed through the dielectric layer. A second layer of very thin conductive metal is deposited on the dielectric layer and in the via hole. The substrate is subsequently patterned with an etch resist and then etched to form the inductor coil and the capacitor plates, which are interconnected via the metallized via hole.