Epoxy resin composition

本发明提供具有高玻璃化转变温度和低介质损耗因数的环氧树脂固化物和提供该固化物的溶剂溶解性优良的环氧树脂组合物。将在分子链末端具有芳基氧基羰基、由芳香族多元羧酸残基和具有体积大的结构的芳香族多羟基化合物残基构成的聚酯作为环氧树脂的固化剂使用。固化物有高的交联密度。另外，该固化物即使交联点的酯键水解，低分子量的羧酸也不游离，在高湿度下，也显示低的介质损耗因数。另外，聚酯具有体积大的结构，可以抑制分子链的结晶化，含有该聚酯的环氧树脂组合物在溶剂中的溶解性优良。 An epoxy resin composition comprises an epoxy resin; and a curing agen...

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Bibliographische Detailangaben
1. Verfasser:	TAKAHASHI KATSUJI,FUJIMOTO KOICHI,IDEMURA SATOSHI,YAMADA MASAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	本发明提供具有高玻璃化转变温度和低介质损耗因数的环氧树脂固化物和提供该固化物的溶剂溶解性优良的环氧树脂组合物。将在分子链末端具有芳基氧基羰基、由芳香族多元羧酸残基和具有体积大的结构的芳香族多羟基化合物残基构成的聚酯作为环氧树脂的固化剂使用。固化物有高的交联密度。另外，该固化物即使交联点的酯键水解，低分子量的羧酸也不游离，在高湿度下，也显示低的介质损耗因数。另外，聚酯具有体积大的结构，可以抑制分子链的结晶化，含有该聚酯的环氧树脂组合物在溶剂中的溶解性优良。 An epoxy resin composition comprises an epoxy resin; and a curing agent including an aromatic polyester having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and another aromatic hydrocarbon group (a2) having a bonding site in an aromatic nucleus are bonded via an ester bond (b) and an aryloxycarbonyl group (c) is the terminal of the polyester.