High radiation miniature package for semiconductor chip

A high radiation micropackaged device of a semiconductor chip includes a wire frame and a base board, among which, a concave platform chip seat is set at the center of the frame with engraved slottedeyes surrounding it, only several supporting plates connecting the seat to the frame, high density circuit and multiple pads and tin balls, a chip joining to the top of the seat of the frame with a binding agent, combining the chip pads and the base board pads with metal wires and filling glue into the engraved slotted eyes, wrapping the metal wires and part surfaces of the frame. 一种半导体芯片的高散热微小封装体，包括一导线架及一基板；该导线架中央设有凹入的平台形芯片座，在该芯片座四周设为镂空的镂空槽孔，仅以数片支撑带将芯片座连接至导线架；该基板贴合于该导线架下方，该基板上设有高密度线路及多数脚垫及锡球，一芯片，该芯片以接合剂接合于导线架的芯片座上方，并以金线连接芯片的脚垫与该基板的脚垫，以封胶填于该镂空槽孔并包覆金线与导线架的部分表面。本发明可以有效地提升整个封装体的脚数及其功能，并利用导线架充当散热片，以降低成本，且可令封装体的整体体积小而薄同时具有高散热功能。