Chip carrier holed semiconductor package element and mfg. method thereof

A semicondcutor packaging unit with an aperture on its chip holder and its process method is to adhered a chip to a chip seat having at least one aperture to shield the back of the chip and expose the aperture, then to fully coat the back that exposes the aperture of the seat, after finishing connecting solder wire of the chip and pin and molding for forming packaging colloid wrapping the said chip and holder, the voide problem between the chip and the seat will not happen when the packaging colloid becomes solid since there is no seam in between, and no die crack or popcorn occur in the products. 一种芯片座具开孔的半导体封装件及其制造方法，在一由芯片座与多条管脚构成的导线架上，黏设一芯片至该开设有至少一开孔的芯片座上，使该芯片的底面遮住并外露出该芯片座的开孔；再于该芯片外露出芯片座开孔的底面上涂布一涂层，令该涂层完全充填于该芯片与芯片座位在该芯片座开孔周侧间的空隙中，在完成电性导接该芯片与管脚的焊线作业及形成用以包覆该芯片与芯片座的封装胶体的模压作业后，由于该芯片与芯片座间无空隙存在，不会造成封装胶体固化成型时于芯片与芯片座间产生气洞(Void)的问题，使完成封装的制成品无芯片碎裂(Die Crack)或产生气爆(Popcorn)之虞。