Method of fixing electronic part

A electronic component fixing method comprising: (a) applying first conductive bonding agent (3) onto first lands of a circuit board; (b) disposing first electronic component (2) on the first conductive bonding agent, followed by melting and hardening the first conductive bonding agent to bond and f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAMURA MASAMI, ASANO MITSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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