Method of fixing electronic part

A electronic component fixing method comprising: (a) applying first conductive bonding agent (3) onto first lands of a circuit board; (b) disposing first electronic component (2) on the first conductive bonding agent, followed by melting and hardening the first conductive bonding agent to bond and fix electrodes of the first electronic component on the first land; (c) fixing the first electronic component on the board by non-conductive adhesive (5); and (d) bonding and fixing electrodes of second electronic component on second lands of the board by second conductive bonding agent. Further, in one preferred embodiment, a melting temperature of the second conductive bonding agent is not less than a melting temperature of the first conductive bonding agent. According to the present invention, no accurate control of a position of application of the non-conductive adhesive is needed, making it very easy to perform the electronic component fixing operation.