Wire solder free semiconductor device and package method thereof

This invention relates to a semiconductor device without weld lines and its packaging method including a lead frame with an enlarged surface at one end with one extending foot terminal. A semiconductor wafer is attached to the surface and one contact on the back surface linked with the frame electrically, the said wafer surface contains a contact leading out an individual footing terminal. No metal weld wire connects the wafer surface contact and the footing terminal but a lamina formed by the lead frame extended base material corresponding to the connection surface which is extended to a unified footing terminal and individual foot terminal welded on one point of the semiconductor wafer directly.