Conductor connect structure and its producing method

The conductor connect structure is applicable to the connection between the grounded backboard and the grounded connection pin on the supply socket. The structure includes the hole and the hook shaped bulge as well as welding material. The preparing method includes following steps. The hole is made...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: BAIHENG ZHAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The conductor connect structure is applicable to the connection between the grounded backboard and the grounded connection pin on the supply socket. The structure includes the hole and the hook shaped bulge as well as welding material. The preparing method includes following steps. The hole is made on the grounded backboard. The hook shape bulge is setup on the grounded connection pin on the supply socket. The hook shaped bulge is put to the hole on the grounded backboard and fixed and locked each other. Then, the welding material is provided for the connection part between the hole and the bulge, and the welding is carried out so as to cover the fixed place.