Ballgrid array parkaging body

A ball-grid array package connected by leading wires features that the power supply rings for the core circuit of a chip on a substrate are at the inside of the power supply ring for I/O circuit of said chip, so its circuit board can be suitable for the ball-grid array package mounted reversely. A b...

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1. Verfasser:	NAISHUN ZHANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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