Ballgrid array parkaging body
A ball-grid array package connected by leading wires features that the power supply rings for the core circuit of a chip on a substrate are at the inside of the power supply ring for I/O circuit of said chip, so its circuit board can be suitable for the ball-grid array package mounted reversely. A b...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A ball-grid array package connected by leading wires features that the power supply rings for the core circuit of a chip on a substrate are at the inside of the power supply ring for I/O circuit of said chip, so its circuit board can be suitable for the ball-grid array package mounted reversely. A ball-grid array package mounted reversely is also disclosed, which features that the power supply rings for the core circuit of a chip on a substrate are at the outside of the power supply ring for I/O circuit of the chip, so its circuit board can be suitable for the ball-grid array package connected by leading wires. |
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