Metal projection structure on input and output contact of substrate or chip and its manufacture method

The present invention relates to a metal salient block structure on the substrate or chip I/O contact. It is formed from several layers of metal which are superposed on the metal conductor of contactconnecting plate, its external layer or upper layer metal is thinner than internal layer or lower layer metal, and its conductivity, contact property and anticorrosion property are good, it is formedinto a column body, its top contact is flat, has no extension can make salient block contact have good conductivity and contact property, and is not easy to be corroded, and the body with required pattern and shape can be formed by utilizing electrode-less electroplating method combining photoresist, exposure and developing technique.