Electronic element processing apparatus and electronic element processing method

An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the electronic components from the adhesiv...

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Bibliographische Detailangaben
1. Verfasser:	SASADA KAZUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the electronic components from the adhesive layer. A driving mechanism moves the blade relative to the adhesive layer along the surface of the adhesive layer while forming a dent in the bottom surface of the adhesive layer by a tip of the blade.