Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same
A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste. |
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