Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same

A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.

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Bibliographische Detailangaben
Hauptverfasser: WANG DANLI, A.I. EVERAERTS, P.A. STARK
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.