Resin composition and flexible printed circuit board

A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 DEG C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or belo...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI AKYOSHI, TSUTSUMI HIDEYUKI, ISHII YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 DEG C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 mu m or below, thickness b: 1.0 mu m or below, and aspect ratio (a/b): 20 or above.