Lead-free solder
A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temp...
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| creator | HESHENG DENG JIANHUI ZHANG YAOQIANG YU |
| description | A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1398697A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1398697A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1398697A3</originalsourceid><addsrcrecordid>eNrjZBDwSU1M0U0rSk1VKM7PSUkt4mFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcUFicmpeakl8c5-hsaWFmaW5o7GhFUAABanHjc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Lead-free solder</title><source>esp@cenet</source><creator>HESHENG DENG ; JIANHUI ZHANG ; YAOQIANG YU</creator><creatorcontrib>HESHENG DENG ; JIANHUI ZHANG ; YAOQIANG YU</creatorcontrib><description>A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment.</description><edition>7</edition><language>eng</language><subject>ALLOYS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030226&DB=EPODOC&CC=CN&NR=1398697A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030226&DB=EPODOC&CC=CN&NR=1398697A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HESHENG DENG</creatorcontrib><creatorcontrib>JIANHUI ZHANG</creatorcontrib><creatorcontrib>YAOQIANG YU</creatorcontrib><title>Lead-free solder</title><description>A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment.</description><subject>ALLOYS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDwSU1M0U0rSk1VKM7PSUkt4mFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcUFicmpeakl8c5-hsaWFmaW5o7GhFUAABanHjc</recordid><startdate>20030226</startdate><enddate>20030226</enddate><creator>HESHENG DENG</creator><creator>JIANHUI ZHANG</creator><creator>YAOQIANG YU</creator><scope>EVB</scope></search><sort><creationdate>20030226</creationdate><title>Lead-free solder</title><author>HESHENG DENG ; JIANHUI ZHANG ; YAOQIANG YU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1398697A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>ALLOYS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HESHENG DENG</creatorcontrib><creatorcontrib>JIANHUI ZHANG</creatorcontrib><creatorcontrib>YAOQIANG YU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HESHENG DENG</au><au>JIANHUI ZHANG</au><au>YAOQIANG YU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Lead-free solder</title><date>2003-02-26</date><risdate>2003</risdate><abstract>A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | Lead-free solder |
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