Lead-free solder

Lead-free solder

A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HESHENG DENG, JIANHUI ZHANG, YAOQIANG YU
Format: Patent
Sprache:eng
Schlagworte:
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment.