Detection method for missing curcuit board wire

The present invention relates to a kind of circuit board detecting method with simple process, high precision and low cost. The detection process includes forming detection area and detecting the electric performance of the detection area. The detection area includes common wires in the bottom side,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: QINGZHI LIN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a kind of circuit board detecting method with simple process, high precision and low cost. The detection process includes forming detection area and detecting the electric performance of the detection area. The detection area includes common wires in the bottom side, most soldering pads in the top side and most probes through the circuit board. The common circuit has several windows with dfiferent inner diameter and aligning to the probes. The detection of the electric performance of the detection area is to test the electric performance among the soldering pads so as to detect whether or not there are some missing.