Luminescent device
The device includes a lead and a resin portion which buries at least a part of the lead. A semiconductor light emitting element is mounted on the lead in an opening formed in the resin portion. A semiconductor element is mounted on the lead in the opening. A wire connects the semiconductor light emi...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The device includes a lead and a resin portion which buries at least a part of the lead. A semiconductor light emitting element is mounted on the lead in an opening formed in the resin portion. A semiconductor element is mounted on the lead in the opening. A wire connects the semiconductor light emitting light and the lead. The lead has a slit formed between a portion where the light emitting element is mounted and a portion where the wire is connected. |
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