Silicon carrier for optical interconnect modules

An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: CROW JOHN D.,DECUSATIS CASIMER M.,KASH JEFFREY A.,TREWHELLA JEAN M
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication with the communication integrated circuit by electrical paths in the silicon carrier. Optical paths in the silicon carrier provide optical coupling between the optical integrated circuit and an optical link.