Silicon carrier for optical interconnect modules
An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication w...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An embodiment of the invention is an optical interconnect module comprising a silicon carrier; a communication integrated circuit mounted on the silicon carrier and an optical integrated circuit flip chip mounted on the silicon carrier. The optical integrated circuit is in electrical communication with the communication integrated circuit by electrical paths in the silicon carrier. Optical paths in the silicon carrier provide optical coupling between the optical integrated circuit and an optical link. |
---|