Leadframe for semiconductor device, method for manufacturing semiconductor device using the same and electronic equipment

Leadframe for semiconductor device, method for manufacturing semiconductor device using the same and electronic equipment

A leadframe to be used in a semiconductor device comprises a plurality of parallel first leads and a plurality of parallel second leads. The pitch of the first leads is different from that of the second leads, and the first leads are joined end-to-end with the second leads. To obtain a leadframe for...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TAKAKURA HIDEYA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A leadframe to be used in a semiconductor device comprises a plurality of parallel first leads and a plurality of parallel second leads. The pitch of the first leads is different from that of the second leads, and the first leads are joined end-to-end with the second leads. To obtain a leadframe for DIP packages, the first leads are encapsulated in a package and the second leads are allowed to project from the package. To obtain a leadframe for SOP packages, the first leads and the second leads are allowed to project from a package and the second leads are cut off later.