Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating

The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of...

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Bibliographische Detailangaben
1. Verfasser: MCCOLLUM GREGORY J.,MORIARITY THOMAS C.,OLSON KEVIN C.,SANDALA MICHAEL G.,WANG ALAN E.,WILSON CRAIGA.,ZAWACKY STEVEN R
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of the resin (a). The resinous phase has a covalently bonded halogen content based on total weight of resin solids present in the resinous phase such that when the composition is electrodeposited and cured, the cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50. The invention also is directed to a method for forming a dielectric coating on an electroconductive substrate using the electrodepositable coating composition, as well as to a substrate coated with the electrodepositable composition.