Formation of thin film resistors

The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BOTTOMLEY STEPHEN E.,CARPENTER RICHARD W.,HENDRICK MICHELLE,HUNT ANDREW T.,SHOUP SHARA S.,LIN WEN-YI,HWANG TZYY JIUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.