Composite board and method for producing the same composite board

Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that t...

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Bibliographische Detailangaben
1. Verfasser:	BETA NINJI,NAGATANI TAMOTSU,KONDO TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THERMAL INSULATION IN GENERAL TRANSPORTING VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).