Stripping liquid nickel or nickel alloy

PROBLEM TO BE SOLVED: To provide a peeling liquid for selectively peeling a nickel or nickel alloy film at a high speed without peeling films consisting of metals other than nickel or nickel alloys, particularly, copper and copper alloy films and tin and tin alloy films. SOLUTION: The peeling liquid...

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Bibliographische Detailangaben
1. Verfasser:	TAKAHASHI KENICHI,KIGURE NAOKI,SAITA ATSUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a peeling liquid for selectively peeling a nickel or nickel alloy film at a high speed without peeling films consisting of metals other than nickel or nickel alloys, particularly, copper and copper alloy films and tin and tin alloy films. SOLUTION: The peeling liquid for nickel or nickel alloys comprises an aqueous solution containing (a) hydrogen peroxide, (b) an inorganic acid, (c) a quaternary ammonium salt and (d) a 3 to 7C aliphatic alcohol. COPYRIGHT: (C)2004,JPO