Surface installation structure and electronic elements included inside

A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating...

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Bibliographische Detailangaben
Hauptverfasser:	AMANO TSUNEO, KICHITA RYUKEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS
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Beschreibung
Zusammenfassung:	A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating substrate, and a piezo-resonator mounted on a mounting surface of the insulating substrate. The piezoelectric component element is mounted on a printed circuit board, with the mounting surface being arranged to face a surface of the printed circuit board. A recess is formed in the printed circuit board and a portion of the piezoelectric component element is accommodated in the recess. A conductive adhesive is located on external connection electrodes provided on the mounting surface and is firmly attached to circuit patterns on the printed circuit board so that the piezoelectric component element is fixed to the printed circuit board. Further, the external connection electrodes are electrically connected to the circuit patterns.