Integrated circuit packaging device with heat dissipation wiring design

Integrated circuit packaging device with heat dissipation wiring design

An IC packaging device with heat-radiating wires design features that a IC chip is put on a substrate and the large-area power supply rings structure electrically connected to other equipotential layers of multi-layer PCB are designed to surround said IC chip. Its advantage is high heat dissipating...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NAISHUN ZHANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An IC packaging device with heat-radiating wires design features that a IC chip is put on a substrate and the large-area power supply rings structure electrically connected to other equipotential layers of multi-layer PCB are designed to surround said IC chip. Its advantage is high heat dissipating effect.