Low noise ball grid array package

Low noise ball grid array package

A low inductance integrated circuit package (10) such as a ball grid array. In order to reduce electromagnetic interference (EMI) caused by an integrated circuit mounted in the package, a filtering device (30) is coupled to at least one of the power and ground lines (40,42) that feeds the integrated...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JAMES C. HUDSON, TAMIO J. HUMPHREY
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A low inductance integrated circuit package (10) such as a ball grid array. In order to reduce electromagnetic interference (EMI) caused by an integrated circuit mounted in the package, a filtering device (30) is coupled to at least one of the power and ground lines (40,42) that feeds the integrated circuit. In a preferred embodiment, a plurality of filtering capacitors (30) are coupled between the power and ground lines (40,42) in or near the cavity (20) of the package.