Method for manufacturing grain dimensional packaged circuit board
A grain-size packed circuit board is made up through such technological steps as pressing the first dry membrane onto thick copper piece as substrate, exposure, developing, electroplating the notchesof dry membrane to form plated gold/plated copper/plated gold three layer plated lines, covering poly...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A grain-size packed circuit board is made up through such technological steps as pressing the first dry membrane onto thick copper piece as substrate, exposure, developing, electroplating the notchesof dry membrane to form plated gold/plated copper/plated gold three layer plated lines, covering polyimide film as protecting layer, attaching the second dry membrane to bottom of copper substrate, etching to remove copper, and laser drilling on polyimide film to form ball-planting holes and alligning holes. Its advantage is simple process (only need of two dry membrane jobs). |
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