One-pack moisture-curable epoxy resin composition

A one-pack moisture curable epoxy resin composition which comprises a ketimine compound represented by a chemical formula (2) which is synthesized from a carbonyl compound represented by a chemical formula (1) in which two same or different alkyl groups each having 2 to 6 carbon atoms are bonded to...

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Bibliographische Detailangaben
Hauptverfasser:	ENDO TAKESHI, MATSUURA NOBUTERU, SANDA FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A one-pack moisture curable epoxy resin composition which comprises a ketimine compound represented by a chemical formula (2) which is synthesized from a carbonyl compound represented by a chemical formula (1) in which two same or different alkyl groups each having 2 to 6 carbon atoms are bonded to a carbonyl group and an amine compound having at least one primary amino group in a molecule, and an epoxy resin, and which has excellent curing properties and good storage stability: wherein R1 is an alkyl group having 2 to 6 carbon atoms, and R2 is an alkyl group having 2 to 6 carbon atoms, wherein R3 is an organic group, R4 is an alkyl group having 2 to 6 carbon atoms, R5 is an alkyl group having 2 to 6 carbon atoms, and n is an integer of 1 or more.