Method for automatically welding package of ball array integrated circuit by coil belt

A package method for automatically welded ball array type of integrated circuit includes forming the first dry membrane on the polyimide film with copper layers on both surfaces, electroplating Cu/Ni/Au/Ni (or Ni/Au, Cu/Ni), removing the first dry membrane, etching the bottom copper layer of polyimide film via the second dry membrane to form multiple caves, laser drilling to form holes, electrolytic plating holes to form protruded connecting points, etching thin copper, stripping nickel, and laser drilling to form installing holes and peripheral through holes of chip. Its advantages include fine connecting points, only need of spot welding and small package area.