Film coating process and its apparatus and making process for semiconductor device

A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting ai...

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Bibliographische Detailangaben
1. Verfasser:	NAKAGAWA SEISHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting air or nitrogen gas blow onto a predetermined area of the material film.