Optimized reverse release process of low-viscosity low-gram-weight die cutting assembly

The invention discloses an optimized reverse release technology of a low-viscosity low-gram-weight die cutting assembly, relates to the technical field of die cutting reverse release, and solves the problems that in the existing reverse release process, reverse release is optimized by changing the roller pressure of net cage assembly, after a protective film is assembled, a C2/C4 angle reverse release phenomenon appears on a copper foil surface, and the production efficiency is improved. The method comprises the following steps that S1, the fold degree of the copper foil is optimized, specifically, back glue is arranged on the surface of the copper foil, and a protective film is arranged on the surface of the back glue, so that the protective film is preferentially adjusted when die cutting reverse release treatment is carried out on a product; the anti-release effect of the protective film can be effectively kept, copper foil wrinkles caused by release generated by back glue are avoided, the glue overflowing