Novel light-emitting diode bonded through welding paste
The invention relates to the technical field of diodes, in particular to a novel light-emitting diode bonded through welding paste, which comprises a first main pipe, an L-shaped groove is formed in the first main pipe, a threaded cover is arranged on the first main pipe, a threaded groove is formed...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of diodes, in particular to a novel light-emitting diode bonded through welding paste, which comprises a first main pipe, an L-shaped groove is formed in the first main pipe, a threaded cover is arranged on the first main pipe, a threaded groove is formed in the first main pipe, and a second main pipe is arranged on the first main pipe. A threaded cover at the top of the first main pipe is opened, a welding wire is input into the first auxiliary pipe through a threaded groove, a first motor is driven, the first motor rotates to drive a first bevel gear to rotate, the first bevel gear rotates to drive a second bevel gear to rotate, and the second bevel gear rotates to drive a first rotating shaft to rotate; the second main pipe is internally provided with soldering paste, the welding wire is adhered with the soldering paste after passing through the second main pipe, enters the third main pipe and is discharged from an outlet of the third main pipe for welding, and |
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