包括具有支撑在插入器上的顶部管芯和底部管芯之间的通孔的有源基础衬底的微电子结构

一种微电子组件及形成所述微电子组件的方法。微电子组件包括:在其中具有第一通孔的第一衬底，第一衬底包括硅或玻璃；第一层，其在第一衬底的前表面上，并且包括耦合到第一通孔的一个或多个第一管芯；第二衬底，其位于第一层的前表面上，并且在其中具有第二通孔，并且包括硅或玻璃；第二层，其在第二衬底的前表面上，第一层在第一衬底和第二衬底之间，第二层包括耦合到第二通孔的一个或多个第二管芯；以及导电结构，其在第一衬底后表面上耦合到第一通孔。 A microelectronic component and a method of forming same. The microelectronic component includes: a first substrate having first through vias therein, the first substrate including silicon or glass; a first layer on a front surface of the first substrate and including one or more first dies coupled to the first through vias; a second substrate on a front surface of first layer and having second through vias therein and including silicon or glass; a second layer on a front surface of the second substrate, the first layer between the first substrate and the second substrate, the second layer including one or more second dies coupled to the second through vias; and electrically conductive structures on a back surface of the first substrate coupled to the first through vias.