ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

An electronic package and a manufacturing method thereof are mainly characterized in that a dam body surrounding an electronic component is configured on a bearing structure provided with the electronic component, the electronic component is wrapped by a heat conduction layer, and the electronic component, the dam body and the heat conduction layer are covered by a heat dissipation member, so that the heat dissipation member is reinforced and supported by the dam body to effectively disperse thermal stress. Therefore, the warping amount of the heat dissipation piece is effectively controlled, and the problem of delamination between the heat dissipation piece and the heat conduction layer is avoided. 一种电子封装件及其制法，主要于一设有电子元件的承载结构上配置一环绕该电子元件的坝体，且以导热层包覆该电子元件，并以散热件遮盖该电子元件、该坝体与该导热层，从而通过该坝体强化支撑该散热件而有效分散热应力，以有效控制该散热件的翘曲量，避免该散热件与该导热层之间发生脱层的问题。